Eaststar New Material (Tianjin) Limited
About Us
Your Professional & Reliable Partner.
EastStar New Material (Tianjin) Limited (hereinafter referred to as EastStar) is well known as a high-tech enterprise specializing in serving such industries as PCB, CCL, semiconductor, woodworking and new energy, etc.EastStar has been specializing in the professional research, development, production and sales of lamination materials and consumables to be used in the relevant products lamination process.Quality is the foundation of a company's existence. EastStar has a group of high-quality R&D ...
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Year Established

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Million+
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Million+
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China Eaststar New Material (Tianjin) Limited HIGH QUALITY
Trust Seal, Credit Check, RoSH and Supplier Capability Assessment. company has strictly quality control system and professional test lab.
China Eaststar New Material (Tianjin) Limited DEVELOPMENT
Internal professional design team and advanced machinery workshop. We can cooperate to develop the products you need.
China Eaststar New Material (Tianjin) Limited MANUFACTURING
Advanced automatic machines, strictly process control system. We can manufacture all the Electrical terminals beyond your demand.
China Eaststar New Material (Tianjin) Limited 100% SERVICE
Bulk and customized small packaging, FOB, CIF, DDU and DDP. Let us help you find the best solution for all your concerns.

quality Lamination Pad & Hot Press Cushion Pad manufacturer

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Rubber Cushion Pads for Solar Photovoltaic Panel Lamination ESCP-PV-G1
Rubber Cushion Pads for Solar Photovoltaic Panel Lamination ESCP-PV-G1   Rubber Cushion Pads for Solar Photovoltaic Panel Lamination ESCP-PV-G1 is playing an important role used in the solar PV Photovoltaic panel (PV module) laminator or press for the purpose of the production of solar photovoltaic panels or modules. The silicon rubber pad usage purpose is  to protect the PV modules in the whole lamination process.   Type ES1200 ES2200 ES3200 ES4200 Hardness (Shaw A) 70±2 70±2 65±2   75±2/60±2 Pulling strength Mpa≧ 11.5 14.2 16.8 48 Tear strength N/mm≧ 45 47 39 45 Temperature resistance℃ 220 240 180 180 EVA resistant(comparative) Middle level Middle level Higher level Higher level Normal service life (times)   >2000 >3000 >4000 >6000 Appearance and color   Black,  glossy/matte or both sides glossy Black, grey, both sides glossy Black,  glossy/matte or both sides glossy Black,  glossy/matte or both sides glossy   Remarks The maximum width of the door can reach 3200mm without seams Special specifications can be customized according to user requirements. As we know, the lamination process is the key link to ensure the high quality of PV panels. It lays the components of the components into the laminator, through the vacuum will be the air between the components, and then heated to make the EVA melting and pressurized, so that the molten EVA flow full of glass and the cell and the back plate gap between the cell and the back plate, and at the same time, through the extrusion to further drain the intermediate bubbles, will be the battery sheet, the glass and the back plate tightly bonded together, and cool down the temperature to solidify.   We are well known as the right producer and supplier for the high quality silicon rubber cushion or buffering pads or plates used in the solar PV module lamination process. 
PCB CCL lamination steel plate press plate ESSP-S630 by EastStar
PCB/CCL Press Plate ESSP-S630T   PCB/CCL Press Plate ESSP-S630 is using high quality made-in-china raw material steel with the steel model of SUS630T, which has more competitive pricing advantage with the great quality reliability.  It has been working reliably in the PCB or CCL laminator as our mature and reliable high-precision lamination steel plate special for PCB or CCL lamination purpose.    Press Steel Plate Performance Parameters:  Models Items SUS630T Mass-Lam plate Pin-lam plate Thickness 1.0-2.0mm 1.0-2.0mm Width ≤1300 ≤1300 Length ≤2410 ≤2410 Thickness tolerance ±0.10 ±0.10 Surface roughness (um) Ra≤0.15 Rz≤1.5 Ra≤0.15 Rz≤1.5 Positioning hole to hole tolerance -- +/-0.10 Standard bushing slot tolerance -- +0.10/-0mm Warpage degree ≤3mm/M ≤3mm/M L/W size tolerance ±1mm ±1mm Yield strength ≥1175 N/mm2 ≥1175 N/mm2 Tensile strength ≥1400 N/mm2 ≥1400 N/mm2 Extensibility ≥5% ≥5% Hardness HRC 50HRC±2 50HRC±2 Work temperature ≤400℃ ≤400℃ Parallelism ≤0.03 ≤0.03 Diagonal deviation 1-2mm 1-2mm Thermal conductivity ≥18W/MK at 300℃ ≥18W/MK at 300℃ Average thermal expansion coefficient (10-6/℃) 10~12 10~12   Product features: Key features of Printed Circuit Board PCB/CCL Press Plate ESSP-S630T:   1. More competitive pricing advantage with reliable lamination performance.  2. It has better thermal conductivity and thermal expansion coefficient, which can save more cost and energy in the production process. 3. It features high corrosion resistance and hardness. 4. Suitable for various types of lamination steel plate washing machines. Technical Parameters: 1. Steel material: SUS630T. 2. Normal thickness (mm): 1.0, 1.2, 1.5, 1.6, 1.8, 2.0. 3.Normal sizes of PCB lamination steel plate/press plate (L*W in mm): 1500*1295/1300*800/1295*787/1295*1613/1295*1143/1295*787/1285*750/1280*1120/1280*1070/1280*970/1270*1118/1270*1070/1143*660/673*571/660*508/24"*28". 4. Normal sizes of copper clad laminate CCL lamination steel plate/press plate (L * W in mm): 1910*1270/2210*1270/2220*1270. Steel material SUS630T. Normal thickness (mm): 1.0, 1.2, 1.5, 1.6, 1.8, 2.0.   Normal sizes of PCB lamination steel plate/press plate (L*W in mm): 1500*1295/1300*800/1295*787/1295*1613/ 1295*1143/1295*787/1285*750/1280*1120/ 1280*1070/1280*970/1270*1118/ 1270*1070/1143*660/673*571/660*508/24"*28". Normal sizes of copper clad laminate CCL lamination steel plate/press plate (L * W in mm): 1910*1270/2210*1270/2220*1270.  
FPC Flexible PCB Flexible Printed Circuit Cushion Pad Heat Rress Lamination Pad ESCP-FPC-G3
FPC Flexible PCB Flexible Printed Circuit Cushion Pad Heat Rress Lamination PadESCP-FPC-G3   FPC (Flexible Printed Circuit) is a circuit board with high flexibility and bendability, typically made of flexible insulating substrates. The characteristics of FPC include being lightweight, bendable, and easy to integrate, which can meet the needs of modern electronic products for miniaturization, lightweight, and portability. FPC (Flexible PCB) Cushion Pad is successfully developed by us and it is specially designed for the purpose of hot lamination buffering during the process of flexible PCB (flexible printed circuit board).  It features great lamination comprehensive performance and higher stability, which can greatly improve the yield and efficiency in the process of flexible PCB or flexible-rigid PCB lamination. Service life 100-200 times High temperature resistance performance ≤260℃ Thickness 1.5-2.0mm. Thickness tolerance ±0.3mm. Size tolerance (length or width) ±2mm. Tensile strength: ≥ 25 MPa Buffer standard ≥ 12% Water absorption standard < 8% (3-8%) The FPC cushion pad (also named as flexible printed circuit board press pad/cushion mat/buffering pad/hot press cushion) is suitable for automated PCB laminating operations and can replace multiple sheets of hot press Kraft paper with one single pad which can greatly save the production material cost by at least 20%.  Product Features: The key advantages of FPCB cushion pad (FPC lamination press pad/cushion mat/buffering pad/hot press cushion) are detailed as below: 1. FPCB cushion pad can be repeatedly laminated for 100-200 times, which can significantly reduce the production cost of flexible PCB (printed circuit board). 2. It performs well in terms of cushion pad flatness, wear resistance, size increase ratio, thickness variation, which is far superior to hot press Kraft paper in the process of flexible PCB lamination. 3. It features better performance in high temperature resistance, which can work for long time at no more than 260℃ without carbonization or brittleness. 4. It features excellent buffering effect and thermal conductivity, stable compression increase and expansion coefficient, and good tear resistance. 5. It is flame retardant, non-toxic and odorless, dust-free and shavings free with good breathability. Product Structure:  Silastic  High elasticity fiber  High molecular weight polymer  Tensile tear layer Technical Parameters: 1. Service life: 100-200 times. 2. High temperature resistance performance: ≤260℃ 3. Thickness: 1.5-2.0mm.  4. Thickness tolerance: ±0.3mm. 5. Size tolerance (length or width): ±2mm. 6. Tensile strength: ≥ 25 MPa 7. Buffer standard: ≥ 12% 8. Water absorption standard :< 8% (3-8%) FYI, FPC (flexible PCB) cushion pad is also known or renamed as FPCB lamination cushion press pad, FPC cushion mat, FPCB buffering pad or FPCB hot press pad. It is the necessary and important cushion and buffering materials to finish the flexible PCB lamination process. 

2025

03/06

PCB/CCL Lamination Carrying Tray and Cover Plate ESCT-Pinlam
PCB/CCL Lamination Carrying Tray and Cover Plate ESCT-Pinlam   PCB/CCL Lamination Carrying Tray and Cover Plate ESCT-Pinlam is specially used for the pinlam process of PCB or CCL lamination purpose.    The Pinlam carrier plate uses pin pins for positioning, ensuring that each layer is not easily slipped during the pressing process and has high alignment accuracy.   All our bearing plates or carrying trays are made of fully hardened steel plate, which is a heat-resistant and wear-resistant steel plate with high strength, high hardness, and high homogeneity. After years of testing and research, our company specializes in providing steel plates for hot press machines in electronic factories (CCL or PCB). is made of the top grading steel which can fully meet the higher and stricter requirements for PCB or CCL lamination process.     Technical parameters of PCB/CCL Lamination Carrying Tray and Cover Plate ESCT-Pinlam     AISI 4140H Pin Lamination purpose Thickness 7.0mm/10.0mm Working temperature ≤400℃ Thickness tolerance +/-0.1mm Parallelism ≤0.05 Length ≤3000mm Surface roughness/treatment Grit 80/Ra≤1.2um Width ≤1300mm Positioning hole-to-hole tolerance +/-0.012 Size tolerance +/-1.0mm Thermal conductivity  W/(m*k) 42 Hardness HRC 40+/-2 Thermal expansion 10-6/℃. 12.9 / 20-300 ℃. Warpage degree ≤0.5mm/m       We can also rename or call PCB/CCL Lamination Carrying Tray as PCB/CCL loading tray, PCB trailer plate, CCL steel carrier tray, PCB lamination carrying plate or CCL lamination steel carrier plate.   The PCB/CCL laminating special carrier tray and top cover plate are using high-end steel, and we deeply know that the stable laminating performance of such product can only be ensured by both selecting high-end raw material steel and using the most advanced processing technology. Our bottom carrier tray and top cover plate can fully meet all the pressing or lamination production needs of the existing PCB and CCL industries.   Product Features: 1.All PCB/CCL lamination carrier plates are featuring smaller dimensional tolerances and higher machining precision. 2. It has longer service life, which can reach 4-5 years. 3.Conventional sizes (mm) of the carrier tray and cover plate for PCB/CCL lamination: 1472*1320/1300*800/1420*850/1295*1500/2220*1270/2120*1270/1920*1270/1270*1070/1270*1120/1295*1143.       We can also rename or call PCB/CCL Lamination Carrying Tray as PCB/CCL loading tray, PCB trailer plate, CCL steel carrier tray, PCB lamination carrying plate or CCL lamination steel carrier plate.   Performance Parameters AISI 4140H Pin Lamination purpose Thickness 7.0mm/10.0mm Thickness tolerance +/-0.1mm Length ≤3000mm Width ≤1300mm Size tolerance +/-1.0mm Hardness HRC 40+/-2 Warpage degree ≤0.5mm/m Working temperature ≤400℃ Parallelism ≤0.05 Surface roughness/treatment Grit 80/Ra≤1.2um Positioning hole-to-hole tolerance +/-0.012 Thermal conductivity  W/(m*k) 42 Thermal expansion 10-6/℃. 12.9 / 20-300 ℃.    The PCB/CCL laminating special carrier tray and top cover plate are using high-end steel, and we deeply know that the stable laminating performance of such product can only be ensured by both selecting high-end raw material steel and using the most advanced processing technology. Our bottom carrier tray and top cover plate can fully meet all the pressing or lamination production needs of the existing PCB and CCL industries.  

2025

03/06

Service life 600-800 times CCL (copper clad laminate)Cushion Pad ESCP-CCL-G1
CCL Cushion Pad ESCP-CCL-G1   CCL cushion pad is the red rigid cushion pad which can well replace hot press kraft paper and improve dimensional safety and stability (industry standard tolerance:+/-300ppm/it can reach+/-250ppm after using such CCL cushion pad). It has excellent lamination comprehensive performance and high stability, which can greatly improve the yield and efficiency in the process of CCL (copper clad laminate) production process. CCL cushion pad is also named or known as CCL lamination cushion pad, CCL cushion mat, CCL buffering pad or CCL hot press cushion pad. It is the necessary and important cushion and buffering materials to finish the CCL (copper clad laminate) lamination process.  CCL cushion pad (press pad/cushion mat/buffering pad/hot press cushion) for CCL (copper clad laminate) lamination purpose is suitable for physical buffering operations in the middle layer and manual operations for multiple sheet replacements. It is also suitable for automated CCL laminating operations and can replace multiple sheets of hot press kraft paper with one single pad. Service life 600-800 times. High temperature resistance performance ≤280℃ Thickness 4mm-6.5mm.  Thickness tolerance ±0.3mm. Normal regular Sizes (L*W in mm): 2220*1270/2120*1270/1920*1270/ 1905*1270/1270*1070/1270*1120/1270*800 Size tolerance (length or width): ±2mm. Tensile strength ≥ ≥ 25 MPa Buffer standard: ≥ 12% Water absorption standard < 8% (3-8%)     Product Features: The product advantages of CCL cushion pad (lamination press pad/cushion mat/buffering pad/hot press cushion for CCL (copper clad laminate) lamination purpose) are summarized as below: 1. It can be repeatedly pressed for 600-800 times, which can significantly reduce the production cost of CCL (copper clad laminate). 2.It performs well in terms of cushion pad flatness, wear resistance, size increase ratio, thickness variation, which is far superior to hot press kraft paper in the process of CCL lamination. 3. It features better performance in high temperature resistance, able to work for a long time at no more than 280℃ without carbonization or brittleness. 4. It features excellent buffering effect and thermal conductivity, stable compression increase and expansion coefficient, and good tear resistance. 5. It is flame retardant, non-toxic and odorless, dust-free and shavings free with good breathability. 6. We can give you the shorter delivery time with more competitive prices and quality control. Product Structure: l  Nano high temperature resistant coating l  Fiberglass cloth l  High molecular weight polymer l  Tensile tear layer l  Polymer aggregates l  Fiberglass cloth l  Nano high temperature resistant coating Technical Parameters: 1. Service life: 600-800 times. 2. High temperature resistance performance: ≤280℃ 3. Thickness: 4mm-6.5mm.  4. Thickness tolerance: ±0.3mm. 5. Normal regular Sizes (L*W in mm): 2220*1270/2120*1270/1920*1270/1905*1270/1270*1070/1270*1120/1270*800 6. Size tolerance (length or width): ±2mm. 7. Tensile strength ≥ 25 MPa 8. Buffer standard: ≥ 12% 9. Water absorption standard :< 8% (3-8%)

2025

03/06